In situ oxide removal, dispersal and drying for copper copper-oxide

ABSTRACT

A method for removing copper-oxide from copper powder, the method comprising: providing a copper powder defined by each particle having a copper core and a copper-oxide layer surrounding the copper core; disposing the particles in an etching solution in a container, wherein the etching solution removes the copper-oxide layer from each particle; decanting the etching solution and by-products; washing the particles; disposing the washed particles in an organic solvent; coating each copper core with an organic material from the organic solvent; dispersing the particles in the organic solvent; and providing the copper powder as dispersed copper cores that are absent a copper-oxide layer and have an organic coating, wherein the steps of dispersing in the etching solution, decanting, washing, disposing in the organic solvent, coating, and dispersing are performed in situ with the plurality of particles disposed in liquid, absent any exposure of the copper cores to air.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent Application Ser. No. 61/284,329, filed Dec. 15, 2009 and entitled “MATERIALS PROCESSING,” which is hereby incorporated herein by reference in its entirety as if set forth herein.

FIELD OF THE INVENTION

The present invention relates generally to the field of powder material production. More specifically, the present invention relates to a process for removing oxide from produced metallic powders.

BACKGROUND OF THE INVENTION

This disclosure refers to both particles and powders. These two terms are equivalent, except for the caveat that a singular “powder” refers to a collection of particles. The present invention may apply to a wide variety of powders and particles. Powders that fall within the scope of the present invention may include, but are not limited to, any of the following: (a) nano-structured powders (nano-powders), having an average grain size less than 250 nanometers and an aspect ratio between one and one million; (b) submicron powders, having an average grain size less than 1 micron and an aspect ratio between one and one million; (c) ultra-fine powders, having an average grain size less than 100 microns and an aspect ratio between one and one million; and (d) fine powders, having an average grain size less than 500 microns and an aspect ratio between one and one million.

Powders are used in a wide variety of applications. Currently, metallic powders (particles having a core that is either a pure metal or a metal alloy) are offered having an oxide shell. FIG. 1 is a cross-sectional side view of a metallic particle 100 having a metal, or metal alloy, core 102 covered by an oxide layer 104. As seen in FIG. 1, the oxide layer 104 can be quite thick, accounting for approximately 60% (sometimes more) of the entire size of the particle 100. This substantial oxide shell may be useful in certain applications. However, in other situations, it may be undesirable to have such a significant oxide presence.

SDC Materials, LLC has developed an in situ process that employs the use of flowing plasma and a vacuum system in order to produce particles having a reduced oxide layer. FIG. 2 is a cross-sectional side view of a metallic particle 200 resulting from this process. The particle 200 has a metal, or metal alloy, core 202 covered by an oxide shell 204. As can be seen by comparing FIG. 2 to FIG. 1, the thickness of oxide layer 204 for particle 200 is significantly reduced from the thickness of oxide layer 104 for particle 100. Using this process, the thickness of the oxide layer can be reduced to less than 10% of the entire particle thickness. While providing a considerable improvement over the particle of FIG. 1, this process still does not achieve complete oxide removal from the particle. As a result, this nano-particle 200 may still prove to be undesirable for certain applications.

Currently, there is no way to create metallic particles having no oxygen. Even the best vacuum system has oxygen in it. As a result, the end product might not be sufficient for those who want oxide-free metallic powder.

What is needed in the art is a method for producing metallic powders that do not contain any oxygen.

SUMMARY OF THE INVENTION

The present invention provides a process for producing metallic powders that do not contain any oxygen. FIG. 3 is a cross-sectional side view of a powder particle 300 that is produced using the process of the present invention. Particle 300 comprises a metal, or metal alloy, core 302, and is characterized by the absence of an oxide shell, in contrast to the particles of FIGS. 1 and 2.

In one embodiment, the process of the present invention comprises providing a powder defined by a plurality of particles. Each particle in the plurality of particles has a metallic core and an oxide layer surrounding the metallic core. The plurality of particles are then etched. This etching serves to remove the oxide layer from each particle in the plurality of particles, leaving only the metallic core. In this fashion, bare metallic powder has been provided free of any oxide.

Additional steps may then be taken to prepare the powder for its eventual application. Each particle in the etched plurality of particles can be coated with an organic layer. The etched powder may also be dispersed using a dispersing solution.

The steps of etching, coating and dispersing are performed in situ with the plurality of particles disposed in liquid, absent any exposure of the metallic cores to air both during and in between these steps.

The final product may be provided as a dispersion of particles stored in a liquid. Alternatively, the final product may be provided as a dried and settled powder absent any liquid.

In another embodiment, a method for removing silicon-dioxide from silicon powder is provided. The method comprises providing a silicon powder defined by a plurality of particles. Each particle in the plurality of particles has a silicon core and a silicon dioxide layer surrounding the silicon core. The plurality of particles is dispersed in a dispersing solution, preferably methanol. An etching solution, preferably hydrofluoric acid, is added to the dispersing solution. The etching solution removes the silicon dioxide layer from each particle.

An organic solvent, such as cyclohexane or toluene, is then added to the mixture of the dispersing solution and the etching solution. The addition of the organic solvent produces an organic phase and an aqueous phase. The organic phase comprises substantially all of the silicon cores and substantially all of the organic solvent, and the aqueous phase comprises substantially all of the dispersing solution, substantially all of the etching solution, and substantially all of the by-products resulting from the silicon dioxide removal. Each silicon core in the plurality of particles is then coated with an organic material from the organic solvent. The aqueous phase is drained out and the organic phase is washed, removing substantially all of the remaining aqueous phase material from the organic phase. The silicon powder can then be provided as a plurality of silicon cores that are absent a silicon dioxide layer surrounding each silicon core, with each silicon core having an organic coating. The steps of dispersing, adding an etching solution, adding an organic solvent, coating, draining, and washing are performed in situ with the plurality of particles disposed in liquid, absent any exposure of the silicon cores to air.

In yet another embodiment, a method for removing copper-oxide from copper powder is provided. The method comprises providing a copper powder defined by a plurality of particles, with each particle in the plurality of particles having a copper core and a copper-oxide layer surrounding the copper core. The plurality of particles are disposed in an etching solution in a container. The etching solution, preferably comprising acetic acid and water, removes the copper-oxide layer from each particle. The etching solution and the by-products resulting from the copper-oxide removal are then decanted, and the plurality of particles are washed, removing substantially all of the remaining etching solution and substantially all of the by-products from the container holding the plurality of particles.

The washed plurality of particles is disposed in an organic solvent, preferably comprising tetraethylene glycol and water. Each copper core in the plurality of particles is then coated with an organic material from the organic solvent, and the plurality of particles is dispersed in the organic solvent. The copper powder may then be provided as a plurality of dispersed copper cores that are absent a copper-oxide layer surrounding each copper core, with each copper core having an organic coating. The steps of dispersing in the etching solution, decanting, washing, disposing in the organic solvent, coating, and dispersing are performed in situ with the plurality of particles disposed in liquid, absent any exposure of the copper cores to air.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional side view of a powder particle having an oxide shell.

FIG. 2 is a cross-sectional side view of a powder particle having a reduced oxide shell.

FIG. 3 is a cross-sectional side view of a powder particle having no oxide shell in accordance with the principles of the present invention.

FIG. 4 is a flowchart illustrating one embodiment of a general work flow in accordance with the present invention.

FIGS. 5A-F illustrate exemplary embodiments of the different powder states during the general work flow in accordance with the present invention.

FIG. 6 is a flowchart illustrating one embodiment of a work flow for silicon powder in accordance with the present invention.

FIGS. 7A-F illustrate exemplary embodiments of the different powder states during the silicon powder work flow in accordance with the present invention.

FIG. 8 is a flowchart illustrating one embodiment of a work flow for copper powder in accordance with the present invention.

FIGS. 9A-H illustrate exemplary embodiments of the different powder states during the copper powder work flow in accordance with the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The following description is presented to enable one of ordinary skill in the art to make and use the invention and is provided in the context of a patent application and its requirements. Various modifications to the described embodiments will be readily apparent to those skilled in the art and the generic principles herein may be applied to other embodiments. Thus, the present invention is not intended to be limited to the embodiment shown but is to be accorded the widest scope consistent with the principles and features described herein.

FIG. 4 is a flowchart illustrating one embodiment of a general work flow 400 in accordance with the principles of the present invention. At step 402, a powder is provided in the form of a plurality of particles having a metallic core and an oxide layer surrounding the metallic core. As previously mentioned, this metallic core may be a pure metal or a metal alloy. The powder is preferably provided in a dry state. FIG. 5A illustrates one embodiment of the powder 500 being provided in a container as a plurality of particles having a metallic core 502 and an oxide layer 504. Typically, the dry powder 500 is settled at the bottom of the container as shown. It is to be understood that FIGS. 5A-F are only provided to illustrate the general principles of the present invention and should not be used to limit the scope of the claims with respect to details such as size, shape and quantity.

At step 404, the particles are then etched in situ. This etching serves to remove the oxide layer from each particle in the plurality of particles, leaving only the metallic core. Preferably, each one of the plurality of particles retains substantially all of its metallic core. In this fashion, a metallic powder has been produced free of any oxide. In a preferred embodiment, the etching is achieved by disposing the powder in an etching solution. FIG. 5B illustrates one embodiment of an etching solution 506 being introduced into the container and interacting with the oxide layer 504 of each particle. The powder 500 can be stirred in the etching solution 506 in order to assist with this interaction. The application of the etching solution 506 may cause the particles to become slightly suspended for a period of time before settling. FIG. 5C illustrates one embodiment of the resulting removal of the oxide layer 504 from the metallic core 502 of each particle.

The powder may then go through an in situ coating/dispersion process at step 406 in order to prepare it for its eventual application. The coating process involves coating each particle that has been etched with an organic layer. This coating may be achieved by disposing the etched powder in an organic solvent. The dispersion process involves dispersing the plurality of etched particles. This dispersion may be achieved by disposing the etched powder in a dispersing solution. While the coating and dispersing processes are grouped together at step 406, they do not necessarily need to occur at the same time. The coating may be performed prior to the dispersing, and likewise, the dispersing may be performed prior to the coating. Furthermore, the existence of one does not necessarily depend on the existence of the other. In fact, the achievement of an oxide-free metallic powder may be achieved in the absence of either or both of these operations. However, in a preferred embodiment, the powder is both coated and dispersed in order to attain optimum stability and preparation. FIG. 5D illustrates one embodiment of a coating and dispersing solution 508 being introduced into the container and interacting with each particle. As a result, the powder is dispersed, and each metallic core 502 becomes coated with an organic material 510, as seen in FIG. 5E.

At step 408, the powder may be provided as a dispersion of particles, with each particle having a metallic core and no oxide shell. Preferably, the powder is maintained as a dispersion in a storage liquid, with each particle having an organic coating surrounding its metallic core. This storage liquid may simply be the coating/dispersing solution or may be some other type of liquid appropriate for storing the powder.

For certain applications, such as sintering, it may not be desirable to provide the powder in a liquid. Instead, circumstances may dictate that the powder be provided in a dry state. In these situations, the oxide-free particles can be dried in situ at step 410. The powder may then be provided at step 412 as dried particles, each having a metallic core, preferably surrounded by an organic coating, and no oxide shell, as seen in FIG. 5F. In the example of sintering, the dried powder may then be placed in a Spark-Plasma Sintering (SPS) machine having a reducing atmosphere. The reducing atmosphere matches the organic layer and serves to reduce the organic layer by burning it off, leaving a pure metallic core and a gas by-product. The metallic cores are then fused together, resulting in an ultra-pure block of metal having nano-properties.

The present invention may be used for a wide variety of metallic powders. Such powders may include, but are not limited to, silicon and copper.

FIG. 6 is a flowchart illustrating one embodiment of a work flow 600 for removing the oxide layer from silicon powder in accordance with the present invention. At step 602, the powder is provided as-produced, with each particle having a silicon core and a silicon-dioxide shell layer. This silicon core may be pure silicon or a silicon alloy. The powder is preferably provided in a dry state. FIG. 7A illustrates one embodiment of the powder 700 being provided in a container as a plurality of particles having a silicon core 702 and a silicon-dioxide shell 704. Typically, the dry powder 700 is settled at the bottom of the container as shown. It is to be understood that FIGS. 7A-F are only provided to illustrate the general principles of the present invention and should not be used to limit the scope of the claims with respect to details such as size, shape and quantity.

At step 604, methanol 706 a is added to the container and then stirred in order get a dispersion of particles, as seen in FIG. 7B.

At step 606, a hydrogen fluoride (HF) solution (i.e., hydrofluoric acid) is added to the container in order to remove the oxide. As seen in FIG. 7C, the result is a plurality of silicon cores 702 dispersed in a mixture 706 b of water, HF and methanol. In a preferred embodiment, the solution contains approximately 10% HF and is applied to the particles for between approximately 1 to 5 minutes at about room temperature. However, it is contemplated that the HF concentration, time applied and environment temperature may vary according to the particular circumstances in which the present invention is being employed.

At step 608, an organic solvent is added to the container. Such organic solvents may include, but are not limited to, cyclohexane and toluene. As seen in FIG. 7D, the addition of the organic solvent produces an organic phase 708, having the organic solvent, on top of an aqueous phase 709, having the silicon cores 702 dispersed in the HF/water/methanol mixture, with a sharp interface in between the two phases. Due to their hydrophobic properties, the silicon cores 702 then diffuse up into the organic phase 708, as seen in FIG. 7E, leaving the HF/water/methanol mixture and any etching products in the aqueous phase 709.

At step 610, the aqueous phase 709 is drained out of the container, taking most, if not all, of the HF/water/methanol mixture and etching products with it, and leaving behind the organic phase 708 with the silicon cores 702 each coated with an organic layer 710, as seen in FIG. 7F.

At step 612, the organic phase 708 may be washed with water in order to remove residual HF and any other undesirable polar material. This washing step may be repeated as many times as necessary in order to achieve optimum residue removal. However, in a preferred embodiment, the organic phase is washed twice with water.

At this point, the process may take two separate paths, either drying the particles at step 614 a or dispersing the particles at step 614 b.

At step 614 a, the organic phase is dried down to only the powder in the container. The particles are then immediately stored in a storage liquid at step 616 a, where they may be re-dispersed. The storage liquid is either in the polar-organic range, such as tetraethylene glycol or other glycol solvents, or the hydrophobic range. This path allows the powder to be used in water-based applications at step 618 and/or organic coating applications at step 620.

At step 614 b, a dispersant is added to the washed organic phase, thereby dispersing the particles. The dispersant may then be used as a storage liquid at step 616 b. This path allows the powder to be used in organic coating applications at step 620.

FIG. 8 is a flowchart illustrating one embodiment of a work flow 800 for removing the oxide layer from copper powder in accordance with the present invention. At step 802, the powder is provided as produced, with each particle having a copper core and a copper-oxide shell layer. This copper core may be pure copper or a copper alloy. The powder is black and is preferably provided in a dry state. FIG. 9A illustrates one embodiment of the powder 900 being provided in a container as a plurality of particles having a copper core 902 and a copper-oxide shell 904. Typically, the dry powder 900 is settled at the bottom of the container as shown. It is to be understood that FIGS. 9A-H are only provided to illustrate the general principles of the present invention and should not be used to limit the scope of the claims with respect to details such as size, shape and quantity.

At step 804, the powder is treated with acetic acid in water. The mixture of acetic acid and water forms an etching solution that is used to remove the oxide layer 904 from the copper core 902. In a preferred embodiment, the solution contains approximately 0.1% to 1% acetic acid. However, it is contemplated that a variety of different concentrations may be employed. FIG. 9B illustrates one embodiment of the acetic acid solution 906 being introduced into the container and interacting with the oxide layer 904 of each particle. The application of the solution 906 may cause the particles to become slightly suspended for a period of time before settling at the bottom of the container. FIG. 9C illustrates one embodiment of the resulting removal of the oxide layer 904 from the copper core 902 of each particle. The etching products (removed copper-oxide, etc.) rise to the upper portion of the mixture, while the resulting copper-colored powder resides on the bottom, typically in a non-dispersed arrangement.

At step 806, one or more decantations is performed in order to remove a majority, if not all, of the etching solution and products. As seen in FIG. 9D, any remaining etching solution 906 and/or etching products is minimal.

At step 808, the powder may then be washed with water 907, as seen in FIG. 9E, in order to remove any remaining etching solution or etching products. This washing step may be repeated as many times as necessary in order to achieve optimum residue removal. However, in a preferred embodiment, the powder is washed twice. Preferably, a minimal amount of the washing water 907 is left in the container, as seen in FIG. 9F.

At step 810, the powder is treated with a tetraethylene glycol (or some other glycol solvent) and water solution 908, as seen in FIG. 9G. The interaction of this solution 908 with the copper cores 902 forms a dispersion of copper cores 902 each having an organic coating 910, as seen in FIG. 9H.

At step 812, the resulting copper particles may be stored in the glycol solvent and water solution. This powder can maintain the same copper coloring for weeks without any discoloration.

The present invention has been described in terms of specific embodiments incorporating details to facilitate the understanding of principles of construction and operation of the invention. Such reference herein to specific embodiments and details thereof is not intended to limit the scope of the claims appended hereto. It will be readily apparent to one skilled in the art that other various modifications may be made in the embodiment chosen for illustration without departing from the spirit and scope of the invention as defined by the claims. 

What is claimed is:
 1. A method for removing copper-oxide from copper powder, the method comprising: providing a copper powder defined by a plurality of particles, each particle in the plurality of particles having a copper core and a copper-oxide layer surrounding the copper core, the copper core selected from the group consisting of a pure copper and a copper alloy; disposing the plurality of particles in an etching solution in a container, wherein the etching solution removes the copper-oxide layer from each particle; decanting the etching solution and the by-products resulting from the copper-oxide removal; washing the plurality of particles, wherein substantially all of the remaining etching solution and substantially all of the by-products are removed from the container holding the plurality of particles; disposing the washed plurality of particles in an organic solvent; directly coating the surface of each copper core in the plurality of particles with an organic material from the organic solvent; dispersing the plurality of particles in the organic solvent; and providing the copper powder as a plurality of dispersed copper cores that are absent a copper-oxide layer surrounding each copper core, each copper core having an organic coating, wherein the steps of disposing in the etching solution, decanting, washing, disposing in the organic solvent, coating, and dispersing in the organic solvent are performed in situ with the plurality of particles disposed in liquid, absent any exposure of the copper cores to air.
 2. The method of claim 1, wherein the step of providing the copper powder comprises providing the copper powder in a dry state.
 3. The method of claim 1, wherein the step of disposing the plurality of particles in the etching solution further comprises each one of the plurality of particles retaining substantially all of the copper core.
 4. The method of claim 1, wherein the etching solution comprises acetic acid and water.
 5. The method of claim 4, wherein the etching solution comprises between approximately 0.1% and 1.0% acetic acid.
 6. The method of claim 1, wherein the organic solvent comprises tetraethylene glycol and water.
 7. The method of claim 1, further comprising the step of storing the plurality of dispersed and coated copper cores in the organic solvent.
 8. The method of claim 7, wherein the organic solvent comprises tetraethylene glycol.
 9. The method of claim 1, wherein the copper powder is a nano-powder having an average grain size less than 250 nanometers.
 10. The method of claim 1, wherein the copper powder is a submicron powder having an average grain size less than 1 micron.
 11. The method of claim 1, wherein the copper powder is ultra-fine powder having an average grain size less than 100 microns.
 12. The method of claim 1, wherein the copper powder is fine powder having an average grain size less than 500 microns.
 13. A method for removing copper-oxide from copper powder, the method comprising: providing a copper powder defined by a plurality of particles, each particle in the plurality of particles having a copper core and a copper-oxide layer surrounding the copper core, the copper core selected from the group consisting of a pure copper and a copper alloy; disposing the plurality of particles in an etching solution in a container, the etching solution comprising acetic acid and water, wherein the etching solution removes the copper-oxide layer from each particle; decanting the etching solution and the by-products resulting from the copper-oxide removal; washing the plurality of particles, wherein substantially all of the remaining etching solution and substantially all of the by-products are removed from the container holding the plurality of particles; disposing the washed plurality of particles in an organic solvent, the organic solvent comprising tetraethylene glycol and water; directly coating the surface of each copper core in the plurality of particles with an organic material from the organic solvent; dispersing the plurality of particles in the organic solvent; and providing the copper powder as a plurality of dispersed copper cores that are absent a copper-oxide layer surrounding each copper core, each copper core having an organic coating, wherein the steps of disposing in the etching solution, decanting, washing, disposing in the organic solvent, coating, and dispersing in the organic solvent are performed in situ with the plurality of particles disposed in liquid, absent any exposure of the copper cores to air.
 14. The method of claim 13, wherein the step of providing the copper powder comprises providing the copper powder in a dry state.
 15. The method of claim 13, wherein the step of disposing the plurality of particles in the etching solution further comprises each one of the plurality of particles retaining substantially all of the copper core.
 16. The method of claim 13, wherein the etching solution comprises between approximately 0.1% and 1.0% acetic acid.
 17. The method of claim 13, further comprising the step of storing the plurality of dispersed and coated copper cores in the organic solvent.
 18. The method of claim 13, wherein the copper powder is a nano-powder having an average grain size less than 250 nanometers.
 19. The method of claim 13, wherein the copper powder is a submicron powder having an average grain size less than 1 micron.
 20. The method of claim 13, wherein the copper powder is ultra-fine powder having an average grain size less than 100 microns.
 21. The method of claim 13, wherein the copper powder is fine powder having an average grain size less than 500 microns. 